AMEYA360:Kingbright AP<span style='color:red'>GF</span>1012GBRC-07 RGB Surface Mount LED
Trade news

AMEYA360:Kingbright APGF1012GBRC-07 RGB Surface Mount LED

　　Kingbright APGF1012GBRC-07 RGB Surface Mount LED consumes low power and comes in a 1mm x 1mm SMD LED and 0.25mm thickness dimension. The green color is made with InGaN on Sapphire LED and the blue color is made with InGaN LED. The hyper-red color is made with AlGaInP on GaAs substrate LEDs. This APGF1012GBRC-07 LED is halogen-free and RoHS-compliant. The APGF1012GBRC-07 RGB LED is ideally used in backlights, status indicators, home and smart appliances, wearable and portable devices, and healthcare applications.　　FEATURES　　1.0mm x 1.0mm SMD LED and 0.25mm thickness dimensions　　Low power consumption　　4000 pcs/reel package　　3 level moisture sensitivity　　Halogen-free　　RoHS compliant　　SPECIFICATIONS　　-40°C to 85°C operating temperature range　　35mW power dissipation　　5V reverse voltage　　10mA DC forward current　　50mA peak forward current　　Water clear lens type　　Emitting colors:　　Green (InGaN):　　80lv minimum and 220lv typical (mcd) at 5mA　　150° viewing angle　　50?A maximum reverse current　　2.85V to 3.3V maximum forward voltage　　45pF typical capacitance　　450V Electrostatic Discharge Threshold (HBM)　　Blue (InGaN):　　10lv minimum and 23lv typical (mcd) at 5mA　　150° viewing angle　　50A maximum reverse current　　2.8V to 3.3V maximum forward voltage　　100pF typical capacitance　　250V Electrostatic Discharge Threshold (HBM)　　Hyper-Red (AlGaInP):　　15lv minimum and 30lv typical (mcd) at 5mA　　150° viewing angle　　10?A maximum reverse current　　1.95V to 2.3V maximum forward voltage　　25pF typical capacitance　　3000V Electrostatic Discharge Threshold (HBM)　　APPLICATIONS　　Backlight　　Status indicator　　Home and smart appliances　　Wearable and portable devices　　Healthcare applications
Key word：
Release time：2023-03-29 11:21 reading：1565 Continue reading>>
Sigfox Founder Seeks ROI in IoT
Trade news

Sigfox Founder Seeks ROI in IoT

　　SAN JOSE, Calif. — Ludovic Le Moan is under the gun to find a return on investment in the Internet of Things this year. After raising $150 million in five rounds, the co-founder and CEO of Sigfox faces a deadline of breaking even before the end of 2018.　　To hit his target, Le Moan estimates that he will need to have about 10 million paying nodes on various Sigfox networks around the world. So far, he has about 4 million.　　Whether he makes his target or not, since the creation of Sigfox in 2000, Le Moan has been driving a vision of creating the lowest-cost network for the Internet of Things.　　Today, a Sigfox link costs about $1.20 to $2 in hardware, down from about $12 several years ago. The company’s revenue comes mainly from connection fees, currently pegged at about $5 to $6 per device per year for users with at least 10,000 nodes.　　Sigfox revealed a design last year that could drop the price to 20 cents or less for a transceiver that could deliver a basic notification. And for operators with 1 million nodes or more, the Sigfox connection fees are already down to $1 per device per year.　　“We started with the idea of delivering small messages in the most efficient way, and one day, it will be close to zero in hardware and transmission costs — this is my goal, one network with roaming around the world,” said Le Moan in an interview with EE Times.　　Today, Sigfox is a distant third to LoRa and Narrowband-IoT (NB-IoT), a low-cost version of LTE with 2017 Sigfox shipments of less than 9,000 modules, according to IHS Markit. The market watcher forecasts that Sigfox could grow to sales of 10 times as many annual connections in 2021, but it would remain a distant third to LoRa and NB-IoT.　　Sigfox depends on a single, venture-backed company and keeps its technology proprietary, noted one analyst. By contrast, NB-IoT and LoRa are based on published standards with products from multiple public companies.　　The company has met the targets of its last four funding rounds by building a prototype, launching a network in France, extending it to Europe, and then going global. Its next and potentially toughest target is to break even in the fourth quarter.　　Le Moan is depending on two of the hottest and most competitive markets in IoT to break into the black — asset tracking and security.　　“We have 500 projects in different verticals, but revenue is mainly in security and asset tracking … for tracking containers, pallets, cars, and luggage, you can’t support a cost above $5 to $6 with a battery, transceiver, and package,” he said. “It’s tough to hit, but as soon as you reach that point, the opportunity is big — this is the first opportunity in IoT.”　　One of the co-developers of the LoRa standard agrees. Hardy Schmidbauer launched his own startup that is rolling out consumer and commercial products for the market this year.　　For its part, Semtech is now sampling a smaller, lower-power version of its LoRa transceiver, but it’s holding costs steady.　　“At the end of the day, the market is so big, but the question is what’s the value of the data … if the module costs a dollar and the value of the data is below a dollar, there is no market,” said Le Moan. “It’s all about what customers need from the data, what value it has for them, and how to extract that value at the lowest cost.”　　The biggest pain point in IoT today is in finding value from currently uncaptured data, he said. “It’s too fuzzy sometimes. We lose time talking about the wrong topics.”　　Last month, Sigfox scored two big deals toward its 2018 goal.　　It signed a deal on Jan. 9 to deploy its network in 20 China cities as part of an elder care solution developed by French startup Seniordom after a one-year, 1,500-person trial. The Chengdu government is chipping in €300 million toward the deployments starting in Chengdu later this year.　　On Jan. 25, the company added partners in four Central and South American countries who will act as exclusive carriers for Sigfox. It now has nine operators/partners in the region, including one in Mexico that Le Moan said had the only running network immediately after an earthquake there last year.　　Le Moan hopes to strike a partnership by the end of the year with a sensor maker such as STMicroelectronics to integrate the Sigfox ultra-low-cost transceiver design into its chips. Sigfox is offering the design royalty-free to any takers.　　“It’s so simple,” he said. “We provide the schematic — its two transistors and a few passives … an ARM Cortex M0 has millions of transistors and may cost 50 cents, so imagine what could be the cost of this transceiver … we need silicon vendors to take the schematic and industrialize it. The price will be a maximum of 20 cents, and it should be lower than that.”　　A Taiwan-based company already integrated an existing Sigfox transceiver into LTE-M modules as a kind of backup network. The work was done in a month and involved 200 lines of new code. The much simpler 20-cent design could get embedded in laptop motherboards and a variety of other products as a built-in asset tracker, suggested Le Moan.
Key word：
Release time：2018-02-09 00:00 reading：1217 Continue reading>>
Few Surprises as Intel, <span style='color:red'>GF</span> Detail Process Technologies
Trade news

Few Surprises as Intel, GF Detail Process Technologies

　　Intel detailed plans to use cobalt for some interconnect layers at 10 nm, while Globalfoundries offered specifics on how it will utilize extreme ultraviolet (EUV) lithography for the first time at the 7-nm node in dueling process technology presentations at one of the most hotly anticipated sessions at the IEEE International Electron Device Meeting (IEDM) here.　　Intel will use cobalt in on the bottom two layers of its 10-nm interconnect to get a five- to ten-fold improvement in electromigration and a two-fold reduction in via resistance. It represents the first time that a chip maker has detailed plans to introduce cobalt — a brittle metal long considered a promising dielectric candidate — in a process, according to G. Dan Hutcheson, chairman and CEO of VLSI Research.　　Globalfoundries, which has said previously that it would insert EUV at the 7-nm node, detailed a platform that is entirely based on immersion optical lithography but is designed to enable the insertion of EUV for specific levels to improve cycle time and manufacturing efficiency. Gary Patton, Globalfoundries chief technology officer and senior vice president of global R&D, said in an interview with EE Times that kinks in EUV still need to be worked out — chiefly pellicle and inspection technologies — but that Globalfoundries is currently installing its first EUV production tools at its Fab 8 in upstate New York.　　Hutcheson told EE Times that he was impressed overall with the presentations by Intel and Globalfoundries and added that hardcore technologists were disappointed with the lack of technical detail, typical for chipmakers that want to keep proprietary information close to the vest. "These guys don't give away anything," said Hutcheson.　　But Hutcheson added that the improvements in logic transistor density that each company showed compared to its previous generation of process technology — above 2X — "show that the industry is still on pace with Moore's Law."　　Both Intel and Globalfoundries had previously announced their newest process technologies. Intel's 10-nm node, first unveiled in March, features FinFETs with a 7-nm fin width at a 34-nm pitch and a 46-nm fin height made using self-aligned quadruple patterning (SAQP). Globalfoundries 7-nm node, first announced in September, uses SAQP to make fins and double patterning for metallization and boasts a 2.8-fold improvement in routed logic density and by up to 40% more performance or 55% lower power compared to its 14-nm process licensed from Samsung. Both processes support multiple voltage thresholds.　　The use of cobalt by Intel for contact metallization at 10 nm could emerge as a differentiator in the advanced semiconductor manufacturing battleground. Globalfoundries at 7 nm continues to use the copper/low-k dielectrics that have been used by the semiconductor industry for the past several nodes.　　In an interview with EE Times following the presentation, Patton and Basanth Jagannathan, a distinguished member of Globalfoundries' technical staff who presented the 7-nm process technology, said that sticking with copper/low-k provides reliability benefits, reducing complexity and yield risk.　　"The copper system still has a lot of juice left in it," said Jagannathan.　　Another clear difference between the process technologies presented is Globalfoundries' use of double-patterning for back-end metallization. In his presentation, Jagannathan argued that using SAQP offers density advantages but also severely hampers flexibility that customers depend on.　　"This is a foundry technology," said Jagannathan. "It caters to all sorts of designs."　　Patton told EE Times that sticking with double-patterning for the back end "doesn't mean we aren't dense. It's not just all about pitches. We get to the density target a little bit of a different way."　　In the same advanced platform technologies in which the Intel 10-nm and Globalfoundries 7-nm technologies were presented, Intel also offered a separate paper on its 22-nm FinFET low-power technology that also captured Hutcheson's attention. This process — billed as ideal for mobile and RF applications — is illustrative of a new trend in which foundry vendors are going back and optimizing older process nodes, he said. "That really is a new trend," added Hutcheson.　　Following the process technology session, Patton was one of three people to receive an IEEE Award. Patton, who said he first attended IEDM as a student 35 years ago, was recognized with the IEEE Frederik Philips Award, awarded for industry influence and leadership in the development of leading-edge microelectronics technology and collaborative research.
Key word：
Release time：2017-12-08 00:00 reading：487 Continue reading>>
Gfast: First Products Certified, Ready for Deployment
Trade news

Gfast: First Products Certified, Ready for Deployment

　　While many homes and businesses rely on cable internet providers, many others (including me) don't — for numerous reasons. Although my 7 Mbps DSL is generally fast enough, many subscribers want higher download speeds with nearly as fast upload speeds. But the so-called "last mile" of copper is often the limiting factor.　　Gfast (formerly G.fast) can deliver speeds approaching 1 Gbps under the right conditions. Now, the University of New Hampshire Interoperability Lab can certify Gfast products for compliance and interoperability. The UNH-IOL and the Broadband Forum have announced that the first eight Gfast products have now been certified, with more to follow. To find out what's behind Gfast, I spoke with UNH-IOL senior engineer Lincoln Lavoie on June 19.　　Why Gfast and not fiber to the premises? "It's the cost," said Lavoie. "At a recent conference, I saw presentations that claim bringing fiber to the premises can be 50% to 60% of the overall delivery cost. If we can use existing copper, that's the business case for Gfast development."　　"Although Gfast uses multiple carriers to carry data, it's fundamentally different than any form of DSL," added Lavoie. For one thing, Gfast is a half-duplex technology, meaning that bits can travel in only one direction at a time as opposed to DSL, which has different carriers for upstream and downstream. Half-duplex transmission makes more efficient use of the available 106-MHz bandwidth, and that's fine for sending and receiving data.　　Service providers can designate the ratio of downstream to upstream service. A typical ratio is 80/20. "That's set at deployment time, not baked into the standards," said Lavoie. As with DSL, Gfast can adapt to the noise and loss conditions of the line. Gfast is also capable of retransmission at the physical layer; video can't afford retransmission at higher layers of the protocol stack. After all, you don't want to miss that football goal or baseball home run. DSL was all about download speeds, but that model has changed. With people now uploading content to social media and using cloud computing, upstream has gained importance.　　The Broadband Forum's Gfast certification program consists of tests performed at UNH-IOL in Durham, New Hampshire. The first six companies to have certified products (eight in all) are Arris, Calix, Huawei, Metanoia, Nokia, and Technicolor. Tests verify interoperability and compliance to standards. The test bed (Fig. 1) consists of spools of wire, ranging from 20 m to 400 m, that can be switched into the loop. In addition, test equipment can inject noise on the line. Gfast devices must be able to adapt speeds to the line conditions.　　The test bed is mostly automated, using equipment from Telebyte. The copper loops shown in Fig. 1 were built at UNH-IOL. A test takes between eight and 12 hours to run. Test plans call for specific cable models, and the test system adjusts the length of cable until its characteristics match those of the model. Tests start with power-spectral density (PSD) measurements on the transmitters. PSD measurements are important because the telcos need to assure that Gfast transmitters won't damage or interfere with other equipment or future deployments. For example, while current Gfast equipment operates at frequencies up to 106 MHz, future systems will go to 212 MHz. Thus, if there's noise between 106 MHz and 212 MHz, tests must account for those future deployments.　　There are also regulatory requirements that vary by region. For example, FM radio, TV, HAM radio, and other services operate at or below 106 MHz and they vary by region. So Gfast equipment must be able to adapt by not using occupied frequencies to avoid interference from those signals. Tests include adding interference signals to see how the DUT adapts. When outside interference occurs, Gfast systems can drop their data rates as needed.　　Will Gfast eclipse the various forms of DSL? That may depend on the progress of 5G. As I see it, the first deployments for 5G will deliver fixed (as opposed to mobile) internet access to premises. Therefore, the last 200 m of copper could go wireless with 1-GHz bandwidths. The race is on. Gfast is definitely ahead of 5G at this point, but I wonder if telcos will hold off deploying Gfast and wait for wireless.
Key word：
Release time：2017-06-22 00:00 reading：1073 Continue reading>>

Turn to

/ 1

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
model brand To snap up
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code